Infineon Technologies AG today announced the opening of its 300mm thin wafer power semiconductor chip plant in Villach, Austria. With a total investment of 1.6 billion euros, the "future-oriented" chip plant is one of the largest projects of its kind in the European microelectronics sector and one of the most modern semiconductor device plants. European Commissioner Thierry Breton; Chancellor Sebastian Kurz of Austria; Dr. Reinhard Ploss, CEO of Infineon Technologies AG; Sabine, CEO of Infineon Technologies Austria AG Dr. Herlitschka was present at the opening ceremony of the new plant. With an eye to achieving long-term profitable growth by increasing efficiency and reducing emissions, Infineon announced in 2018 the construction of a new chip factory for the production of power semiconductor devices (energy-efficient chips). Dr. Reinhard Ploss, CEO of Infineon, said: "The new plant is another important milestone in the history of Infineon and the start of operation is very good news for our customers. Due to the growing global demand for power semiconductor devices, now is the best time to add new capacity. The market situation of the last few months has made it clear that microelectronics technology is vital and covers almost every area of life. With the acceleration of digitization and electrification, we expect the global demand for power semiconductor devices to continue to grow in the coming years. The new capacity will help us better serve our customers around the world over the long term."